Custom ASIC for Consumer Electronics

Continuous customer success stories

Consumer ASICs

  • MediaTek's Consumer ASICs are known for their performance, efficiency, connectivity, multimedia capabilities, and customization options, making them a leading choice in the semiconductor industry.
  • These chips integrate multiple hardware components, use power efficient packaging technologies, support various wireless communication technologies, provide advanced multimedia features, and prioritize security, making them a compelling choice for device manufacturers looking to build innovative and differentiated consumer products.
  • MediaTek's Consumer ASICs are custom-designed chips that offer high-performance, low-power, and cost-effective solutions for a wide range of consumer electronic devices, such as smartphones, tablets, smart TVs, wearables, gaming consoles, and more.

Ideal for companies seeking custom ASIC solutions for differentiation and uniqueness

Why Choose MediaTek?

MediaTek is an ideal partner for enterprise companies seeking custom ASIC solutions. Now over 25 years in business, we have grown to become the world’s 5th largest fabless semiconductor company. We’re capable of building high quality, highly performance efficient ICs at large volumes that can be shipped globally.

Pick from a range of chip building blocks like CPUs, GPUs, AI, multimedia, display processors, camera ISPs, wireless and wired connectivity, or supply your own, then create high quality, high-performance ICs using advanced packaging, at volumes small-to-large, through our extensive partner ecosystem.

  • Extensive expertise in cutting-edge chip design
  • Very broad IP portfolio
  • Demonstrated time-to-market delivery
  • Active involvement and commitment to global technology standards
  • Deep ecosystem with global reach
  • Over 7,000 Patents
  • Over 2 billion products sold annually

Create Consumer ASIC Solutions with MediaTek

From concept through support, MediaTek has you covered.


The Process

Feasibility Study

Understanding and working to enable your idea, even for high-performance designs in highly power constrained situations, and unique environmental operations or use-cases.

Project launch

Spec the solution and bring together IP elements from MediaTek and 3rd party suppliers.


Creating your ASIC with the skills of our world-class engineers. MediaTek provides expert support for ASIC design, testing, and validation, which can help companies reduce time-to-market and ensure product quality.


MediaTek has extensive partnerships with all leading suppliers in the SoC manufacturing chain; from foundry partners, to assembly, packaging and testing. If customers have preferred partners, this requirement can be accommodated.


Support for monolithic SoC, MCM or SiP designs, using 2D, advanced 2.5D or the latest 3D packaging technologies enables the widest possibility of cutting-edge chip designs.


Business scale global shipping in reliable supply channels.

Longevity & Support

MediaTek ASIC solutions are designed for long-term use, with a focus on reliability and durability, which can help companies avoid costly redesigns and replacements.

Meeting the Challenges of Your Application

Consumer Electronics products are often required to meet a wide variety of challenges, depending on their end-user application. MediaTek is an expert in maintaining high-performance and low latency in power constrained situations, and can actively balance a multitude of compute elements within an SoC in response to user behavior.

MediaTek has expertise to design ASIC solutions for CE devices using Arm Cortex CPUs, advanced graphics IP, high performance on-chip/inter-chip interconnects, large embedded SRAM, accelerators for multimedia, cameras and displays, and diverse memory and storage options. We are also one of the few global semiconductor companies to offer comprehensive wireless connectivity IP that includes Bluetooth, Wi-Fi, global cellular, LPWAN, and satellite.

Customization Potential:

  • Data Encryption / Decryption
  • Data Compression / Decompression
  • Heterogeneous Compute
  • Multimedia Accelerators
  • Network Packet Processing
  • AI / ML
  • SRAM, LPDDR5, DDR5, HBM, and more
  • Advanced interconnects
  • Wide-ranging I/O options including PCI-Express, USB, MIPI, UFS, SPI, GPIO, and many others
  • Ethernet, Global Cellular, Satellite, Wi-Fi & Bluetooth Connectivity
  • Custom IP blocks

Power Consumption

With our expertise in mobile products, our innate understanding of power efficiency maximizes performance per watt, and performance per dollar. MediaTek’s ASICs solutions are designed to be exceptionally power-efficient and are ideal for battery-powered devices, expending energy to precisely meet user experience expectations, which can reduce power consumption compared to general-purpose platforms.


MediaTek can accommodate cryptographic IP from trusted sources and partners, allowing ASIC to be designed with built-in security features that meet specific designs, such as encryption/decryption or authentication, to help protect against potential security threats. Unique and novel solutions are fundamentally more difficult to attack than common processor platforms.

  • Accommodate custom security IP
  • Commitment to secure products

Workload Optimization Potential:

  • Mobile and battery-powered products
  • Multimedia streaming | (Multi) Camera devices
  • Edge-AI or hybrid edge/cloud processing
  • Heterogeneous processing: CPU, AI and GPU blended tasks
  • Voice and visual processing
  • Wall-size to wrist-size display-centric applications
  • Whole home entertainment, IoT, and connectivity
  • Seamless hybrid connectivity
  • In-vehicle technologies maximizing EV range
  • Optical disc for archival storage and entertainment

Advanced Packaging

The choice of chip packaging is crucial to leading-edge chip design. MediaTek’s assured supply chain and partner ecosystem can accommodate monolithic silicon die designs with the ability to accommodate a single large area, and multi-chip module using various 2D, 2.5D or 3D layering on active or passive packages. Our extensive expertise allows us to meet a wide array of challenges in layout, yield, power consumption and thermal design at the initial feasibility and design stage, ensuring the optimal direction is selected from the very start.

  • Leading expertise in performance, power, thermal & cost factors
  • SoC, SiP, MCM chip design
  • 2D, 2.5D, 3D chip design
  • Active/passive packaging

Longevity and Support

With a commitment to contributing to global technology standards, our deep partner ecosystem and global sales reach, MediaTek has a long track record of demonstrating successful time-to-market delivery while pursuing all client environmental and sustainability targets. Collaborating with us on a project ensures a long-term commitment and support to ensure your success.

Contact Us

Please contact MediaTek ASIC design solutions, and let's start a discussion about your custom chip design needs.